Description: Herein, PSI propose a system-on-chip (SoC) solution for an entangled photon pair source (EPPS) based on thin-film lithium niobate on insulator (TFLNOI) photonic integrated circuits (PIC). Using integrated photonic devices such as fiber coupler, waveguide, modulator, splitter/combiner and micro-ring, the proposed EPPS can generate and process the entangled photons with high efficiency and speed. In phase I effort, we developed theoretical models to study the spontaneous parametric down conversion (SPDC) conversion efficiencies based on both hybrid and ridge waveguide LNOI PIC designs. We have successfully demonstrated an in-situ monitored periodically poling process with small poling periods and large poling gaps. Leveraging other on-going PSI projects, we have also fabricated and characterized the key PIC components for the proposed EPPS chip, including low-loss waveguides, fiber coupler, high extinction splitter/combiner, micro-ring resonator and high-speed modulator. The phase I result paved a solid foundation toward a high-efficiency EPPS PIC chip. In phase II, we will continue the PIC components development focusing on the ridge waveguide designs, and experimentally demonstrate all the key PIC components. We will further refine the periodically poled LNOI (PPLNOI) process with improved accuracy and automation. Through the collaboration with RIT, our subcontractor, who has significant experiences in quantum photonic system testing and characterization, we will demonstrate the entanglement of the SPDC generated photon pair. Lastly, we will perform initial integration and packaging for the EPPS chip based on advanced photonic wire-bonding technology. Based on our pioneer work in TFLNOI PICs development and with our successful experiences in commercialization of SBIR research efforts, PSI is poised to develop, package, qualify and commercialize the proposed EPPS chip for tomorrow’s quantum communication demands.

Benefits: High quality entangled photon pair is needed almost in all quantum technologies from quantum communication to quantum computing. As NASA explore deep space in the next decades, reliable, secure and high-volume data communication is in urgent demands. Having a high-efficiency, high-speed, low SWaP-C, reconfigurable, integratable PIC-based entangled photon source will not only meet the challenge for many current system, but will also enable many new applications such as quantum internet, high-sensitive sensing and quantum computation.

Rapid development in quantum information technology demands high-efficiency, reliable and integrated quantum light source. Similarly, photon-based quantum computing also requires entangled photon generation as well as complicated processing. The potential commercial market of the proposed PIC chip is vast. To this end, a SOC PIC-based source is the only viable solution to meet the requirements.