Description: We propose to develop chip-scale squeezer and chip-scale pump laser that can be co-packaged in a typical butterfly like package for significant size, weight and power (SWaP) improvement to enable squeezed light source quantum sensing applications. Squeezed-light injection into the LIGO interferometer is now regularly implemented to achieve quantum-enhanced sensitivity. Likewise, by injecting squeezed light into a classical sensor, the sensitivity can be improved beyond the classical limit.

Benefits: The proposed co-packaged photonic integrated chip (PIC), directly addresses the critical gap of the Quantum Sensing and Measurement scope of topic T8.06. More specifically, it will significantly reduce the SWaP of the squeezed light source (including the pump laser), while providing very high robustness as both chips are integrated on silicon substrates that are co-packaged on same carrier to enable quantum sensing applications on aerospace platforms.The developed PIC and components will be tailored to NASA needs, but the processes and components will also be commercialized with our quantum commercial partners.