Description: The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages.